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SOP PACKAGES

Anst offers a wide variety of SOP (Small Outline Package) in the popular "gull-wing" lead format. Body sizes range from 3 x 3mm for the MSOP to the 11.2 x 20.5mm wide body SOIC. Lead counts range from 8 to 48 with lead pitches from 0.5mm to 1.27mm.

Availability

SOP

Small Outline Package

HSOP

Heat-sink Small Outline Package

SOIC

Small Outline Integrated Circuit

SSOP

Shrink Small Outline Package

QSOP

Quarter-pitch Small Outline Package

TSSOP

Thin Shrink Small Outline Package

MSOP

Mini Small Outline Package

FCSOIC

Flip Chip Small Outline Package


Package Type

Lead Count

(FC)SOIC(EP) (150mil)

7 / 8 / 14 /16

SOIC (208mil)

8

SOIC (300mil)

16 / 20 / 24 / 28

SOIC (330mil)

28

SOIC (440mil)

32

HSOP (300mil)

28

SSOP(5.3mm)

20 / 24 / 28

SSOP(6.0mm)

24

SSOP(7.5mm)

48

MSOP(EP)(3.0mm)

8,10

TSSOP(4.4mm)

8 / 14 / 16 / 20 / 24 / 28

TSSOP(6.1mm)

48

QSOP(3.9mm)

20 / 24 / 28

FCSOIC

8/16

SOP(3.9mm)

8 / 14 / 16

SOP(5.1mm)

20

SOP(7.5mm)

18 / 24 / 28 / 32

Bill of Material

Leadframe

C 194 

Die Attach

Conductive Epoxy - 8290 / DAD90B2 / 2815 / 84-1MISR4

Non-conductive Epoxy - 84-3J

Wire Bond

18 / 20 / 25 / 30 / 33 / 38um Gold Wire

20 / 25 / 30 / 38 / 42um Copper Wire

Mold Compound

Henkel KL 1000 Series(Non-green) / Hitachi CEL-8240 / Sumitomo EME G600 Series (Green)

Lead Finish

Pure Tin 

Marking

Top / Bottom - Laser( Expect for Exposed Pad Packages)

 

SSOP(5.3, 6.0 & 7.5mm)

Leadframe

C 194 

Die Attach

Conductive Epoxy - 8290 / 84-1LMISR4 / 2815A / DAD90B2

Non-conductive Epoxy - 84-3J

Wire Bond

18 / 20 / 25 / 30 / 33um Gold Wire

20 / 25um Copper Wire

Mold Compound

Hitachi CEL-8240 / Sumitomo EME G600 / G700 Series(Green) / Sumitomo EME 6600HR Series

Lead Finish

Pure Tin

Marking

Top / Bottom - Laser

 

TSSOP(4.4mm)

TSSOP(6.1mm)

Leadframe

C7025

C194

Die Attach

Conductive Epoxy - 8290 / 84-1LMISR4 / 2815A

Conductive Epoxy - 84-1LMISR4

Wire Bond

18 / 20 / 25 / 30 / 33 / 38 / 50um Gold Wire

20um Gold Wire

20 / 25 / 30 / 42um Copper Wire

Mold Compound

Hitachi CEL-8240 / Sumitomo EME G600 / G700 SERIES (Green)

Lead Finish

Pure Tin 

Marking

Top / Bottom - Laser( Expect for Exposed Pad Packages)

 

SOP

HSOP

QSOP

MSOP(3.0mm)

Leadframe

C194 

C7025

Die Attach

Conductive Epoxy - 8290 / DAD90B2 / 2815A

Non-conductive Epoxy - 84-3J / QMI 536NB

Wire Bond

18 / 20 / 25 / 30 / 33 / 38um Gold Wire

20 / 25 / 30 / 38 / 42um Copper Wire

Mold Compound

Henkel KL 4000 Series / Hitachi CEL-8240 / Sumitomo EME G600 / G630 SERIES (Green)

Lead Finish

Pure Tin 

Marking

Top / Bottom - Laser

Datasheet / Drawings

Datasheet
 Please contact Sales Office
Drawings
 Click to view Package Outline
 (Q)SOP  SOIC(HSOP)
 SSOP  TSSOP
 MSOP  

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