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TSOT PACKAGES
Anst offers standard TSOT23 packages for the manufacturers of discrete devices, passives, and low lead count IC devices.
Some of these packages are also available in flip chip configurations.

Availability

(FC)TSOT

(Flip Chip) Thin Small Outline Transistor


Package Type

Lead Count

(FC)TSOT

5/6/8

Bill of Material

Leadframe Material

C194

Die Attach

Conductive Epoxy - 84-1 LMI-SR4 / 8290
Non-conductive Epoxy - 84-3J / QMI538NB

Wire Size

20 / 25 / 30 / 33um gold wire
20 / 30 / 42um copper wire 

Mold Compound

Sumitomo G600 Series (Green)

Marking

Top / Bottom - Laser 

Lead Finish

Pure Tin

Datasheet / Drawings

Datasheet
 Please contact Sales Office
Drawings
 Click lead count to view Package Outline
 TSOT - 5 / 6 / 8 L  

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